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? 2016 microchip technology inc. ds20005598a-page 1 pl130-07 features lvcmos output selectable drive capability - drive 15 pf or 30 pf output load single ac-coupled input (min. 100 mv swing) accepts lvcmos or sine wave inputs input range from 10 mhz to 200 mhz oe high (pl130-07) or oe low (pl130-07a) enable 2.5v to 3.3v operation available in 8-pin soic, 8-pin tssop and 3 mm x 3 mm 16-pin qfn general description the pl130-07 is a low cost, high performance, high speed, buffer that repro duces any input frequency from 10 mhz to 200 mhz. it provides an lvcmos output with 15 pf output load drive capability. any input signal with at least 100 mv swing can be used as reference signal. this chip is ideal for conversion from sine wave to lvcmos. block diagram pl130-07 input amplifier clk_in clk_out oe high speed translator buffer to lvcmos downloaded from: http:///
pl130-07 ds20005598a-page 2 ? 2016 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? supply voltage (v dd ) .............................................................................................................................. .................+4.6v input voltage (dc)............................................................................................................. ................C0.5v to v dd + 0.5v output voltage (dc) ............................................................................................................ ..............C0.5v to v dd + 0.5v hbm esd rating................................................................................................................. .......................................2 kv ? notice: stresses above those listed under absolute maximu m ratings may cause permanent damage to the device. this is a stress rating only and functiona l operation of the device at those or an y other conditions above those indicated in the operational sections of this specification is not intended. exposure to maximum rating conditions for extended periods may affect device reliability. downloaded from: http:///
? 2016 microchip technology inc. ds20005598a-page 3 pl130-07 table 1-1: ac electrical characteristics parameters sym. min. ty p. max. units conditions input frequency 10 200 mhz input signal swing 100 mv clk_in input output frequency 10 200 mhz table 1-2: cmos output el ectrical characteristics parameters sym. min. typ. max. units conditions output high voltage v oh 2.4 vi oh = 12 ma output low voltage v ol 0 . 4v i ol = 12 ma output high voltage at cmos level v ohc v dd C 0.4 v i oh = C4 ma output drive current 36 51 ma at ttl level (high drive, note 1 ) 12 17 ma at ttl level (standard drive) quiescent supply current i dd 5.9 ma no input signal, v dd = 2.5v 12.7 ma no input signal, v dd = 3.3v note 1: high drive cmos is selectable through driv_sel selector input on pin 8(soic) or 13(qfn). table 1-3: cmos switching characteristics parameters sym. min. typ. max. units conditions output clock rise/fall time t r /t f 1.15 ns 0.8v ~ 2.0v with 10 pf load 3.7 ns 0.8v ~ 3.0v with 15 pf load output clock rise/fall time (high drive, note 1 ) t r /t f 0.5 ns 0.8v ~ 2.0v with 10 pf load 1.5 ns 0.8v ~ 3.0v with 15 pf load note 1: high drive cmos is selectable through driv_sel selector input on pin 8(soic) or 13(qfn). downloaded from: http:///
pl130-07 ds20005598a-page 4 ? 2016 microchip technology inc. temperature specifications ( note 1 ) parameters sym. min. typ. max. units conditions temperature ranges storage temperature range t s C65 +150 c ambient operating temperature t a C40 +85 c note 2 junction temperature t j +125 c lead temperature +260 c soldering, 10 seconds note 1: the maximum allowable power dissipation is a functi on of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., t a , t j , ? ja ). exceeding the maximum allowable power dissipation will cause the de vice operating junction te mperature to exceed the maximum +125c rating. sustained junction temperat ures above +125c can impa ct the device reliability. 2: operating temperature is guaran teed by design for all parts (commercial and industrial), but tested for commercial grade only. downloaded from: http:///
? 2016 microchip technology inc. ds20005598a-page 5 pl130-07 2.0 pin descriptions the descriptions of the pins are listed in table 2-1 . pin configurations pl130-07 (top view) l130-07 12 3 45 6 7 8 gnd clk_in gnd vdd drv_sel^gnd clk_out vdd soic-8l pl130-07(a) (top view) l130-07(a) 12 3 45 6 7 8 vdd drv_sel gnd oe clk_outdnc clk_in vdd tssop-8l pl130-07(a) (top view) l130-07(a) clk_out n/c gnd vdd 1234 12 11 10 9 13 1415 16 87 6 5 vdd vdd gnd vdd gnd drv_sel gnd oe gnd gnd clk_in gnd qfn-16 downloaded from: http:///
pl130-07 ds20005598a-page 6 ? 2016 microchip technology inc. table 2-1: pin function table pin name soic-8l tssop-8l qfn-16l type description gnd 1, 3, 6 3 1, 2, 4, 5, 9, 14, 15 p ground. v dd 4, 7 1, 7 7, 10, 11, 12 p power supply. drv_sel 8 2 13 i drive select input: 1 for standard drive, 0 for high drive output. internal pull-up (default is 1). clk_in 2 5 3 i clock input signal. the frequency of this signal will be reproduced at the output (after translation to cmos level). clk_out 5 8 8 o cmos clock output. oe n/a 4 16 i output enable. see ta b l e 2 - 2 . table 2-2: oe logic table part number oe state output buffer state pl130-07 0 tri-state 1 (default) active pl130-07a 0 (default) active 1t r i - s t a t e downloaded from: http:///
? 2016 microchip technology inc. ds20005598a-page 7 pl130-07 3.0 packaging information 8 lead tssop package outline and recommended land pattern note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
pl130-07 ds20005598a-page 8 ? 2016 microchip technology inc. 8-lead soic package outline and recommended land pattern note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2016 microchip technology inc. ds20005598a-page 9 pl130-07 16-lead qfn 3 mm x 3 mm package outline and recommended land pattern note: for the most current package draings, please see the microchip packaging specification located at http://.microchip.com/packaging. downloaded from: http:///
pl130-07 ds20005598a-page 10 ? 2016 microchip technology inc. notes: downloaded from: http:///
? 2016 microchip technology inc. ds20005598a-page 11 pl130-07 appendix a: revision history revision a (july 2016) converted micrel document pl130-07 to micro- chip data sheet ds20005598a. minor text changes throughout. downloaded from: http:///
pl130-07 ds20005598a-page 12 ? 2016 microchip technology inc. downloaded from: http:///
? 2016 microchip technology inc. ds20005598a-page 13 pl130-07 product identification system to order or obtain information, e.g., on pricing or delivery, contact your local microchip representative or sales office . examples: a) pl130-07oc: high speed translator buffer to lvcmos, high enable, tssop-8l, commercial temp. range, tube b) pl130-07oc-r: high speed translator buffer to lvcmos, high enable, tssop-8l, commercial temp. range, tape & reel c) pl130-07aoi: high speed translator buffer to lvcmos, low enable, tssop-8l, industrial temp. range, tube d) pl130-07aqi-r: high speed translator buffer to lvcmos, low enable, qfn-16l, industrial temp. range, tape & reel e) pl130-07sc: high speed translator buffer to lvcmos, high enable, soic-8l, commercial temp. range, tube part no. x package type device device: pl130-07: high speed translator buffer to lvcmos oe state: (blank) = high enable a = low enable package type: o = tssop-8l q= qfn-16l s= soic-8l temperature c = commercial temperature range i = industrial temperature range media type (blank) = tube r = tape & reel x oe state x temperature x media type downloaded from: http:///
pl130-07 ds20005598a-page 14 ? 2016 microchip technology inc. notes: downloaded from: http:///
? 2016 microchip technology inc. ds20005598a-page 15 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microc hip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered tradem arks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-0805-5 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchips c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the companys quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microper ipherals, nonvolatile memory and analog products. in addition, microchips quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
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